
Thin-Film Metallization
Using vacuum sputtering, evaporation and photolithographic patterning, we deposit precision metal films of 0.05μm ~ 5μm on ceramic, alumina, AlN and similar substrates — meeting next-generation thermal management, optical and RF packaging applications.
- Multiple alloy systems: Cr / Ni / NiCr / Au / Pt
- Pattern accuracy ±5μm, film thickness uniformity ≤ 3%
- Supports large substrates 50.8mm × 50.8mm ~ 200mm × 200mm
- ROHS / REACH compliant throughout the process



